国际口腔医学杂志 ›› 2025, Vol. 52 ›› Issue (4): 436-442.doi: 10.7518/gjkq.2025078
摘要:
口腔修复软组织管理是决定修复体功能与美学效果的关键,其中固定修复涉及排龈、牙龈修整及牙冠延长术;在活动修复中主要强调微创系带修整与前庭沟成形;而种植修复则侧重于种植二期手术、软组织塑形及种植体周围炎的治疗。半导体激光具有独特的生物效应,能与口腔软组织发生相互作用,展现出显著的修复临床优势。相较于传统机械切割或电刀手术,半导体激光能减少术中出血、减轻术后疼痛并缩短愈合时间,从而提升患者舒适度与修复效果。通过深入了解半导体激光在口腔修复软组织中的应用原理和临床效果,能进一步优化治疗方案,提高治疗效果,为患者提供更加安全、舒适和高效的口腔修复治疗。本综述旨在解释半导体激光的基本原理、生物效应及其与口腔软组织的相互作用,并介绍其在口腔修复软组织管理中治疗模式和策略的选择,推动半导体激光在口腔修复中的广泛应用。
中图分类号:
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